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Innovative Chipset Delivers a True PC Experience From Datacenter to Desktop
Vancouver, British Columbia; June 18, 2007 --
Teradici Corporation, a well-funded, privately-held semiconductor company, today announced an application specific integrated circuit (ASIC) chipset based on breakthrough algorithm innovations in image and I/O bridging. This groundbreaking technology platform for the first time delivers a complete PC or workstation user experience over standard corporate networks.
"Despite their inherent advantages for enterprise use, thin clients have met huge levels of resistance from users not willing to relinquish the full functionality of a local PC," said John Abbott, chief analyst, The 451Group. "Blade PCs solved some of this problem, but have remained too expensive for widespread usage. Teradici's technology - in conjunction with the recent advances in desktop virtualization - could finally tip the balance. Teradici has come up with a no-compromise way of separating users from their computers over standard IP networks."
Teradici has developed sophisticated compression algorithms and transparent hardware bridging technology to create a full, responsive, and multimedia-rich PC experience.
The TERA Host and Portal chipset is the engine of Teradici's PC-over-IPTM technology. In the datacenter, PC or workstation blades, rack mount or tower PCs integrate the TERA Host Processor. At the end user's desk, the TERA Portal Processor is integrated into a very simple, stateless device. The TERA Image Engine combines a powerful RISC processor core and a high speed RAM interface to encode and decode the image data over standard IP networks.
"The TERA Image Engine on the PC-over-IP Host and Portal Processors uses unique compression algorithms to dramatically reduce the amount of data that needs to be communicated over the network for screen updates," said Dave Hobbs, co-founder and chief architect, Teradici. "The real-time execution of these compression algorithms requires an enormous amount of processing power that can only be efficiently realized using a specialized silicon architecture."
By developing purpose built silicon to bridge image and I/O data at the physical layer, Teradici's PC-over-IP solution generates zero load on the host PC and enables a truly stateless, secure and unmanaged user desktop appliance without any local user application execution. Full USB peripheral support and high-definition audio functionality are implemented using a completely transparent hardware bridging approach.
"Teradici's experienced team of silicon and hardware engineers has rapidly developed an extremely complex and groundbreaking device," says Maher Fahmi, vice president of Silicon Engineering, Teradici. "The rigorous design methodologies followed by our team of industry veterans enabled the company to reach its goal of first silicon success."
"Our algorithm team worked tightly with the silicon team to develop and model the complex image algorithms which intelligently encode and decode the display information," stated Ken Unger, vice president of Software Engineering. "Our experienced SoC firmware team working in collaboration with the silicon team led to the significant technology innovation in our product."
Teradici developed a standard application programming interface (API) to provide seamless integration with existing connection management software. This enables powerful session management functionality to control connections between the host PC and the portal device and authorization of peripheral devices.
The TERA1202 Host Processor and TERA1100 Portal Processor are packaged in 600 pin HSBGA packages and are sampling now. Full Host and Portal reference design kits and evaluation systems are also available.
Teradici has been aggressively filing U.S. patents to cover both its silicon and the system implementation of its intellectual property. These efforts will continue.
Earlier this year the company announced an oversubscribed 'B' round funding of $18 million. Alloy Ventures led the round with participation from return investors the Working Opportunity Fund, Skypoint Capital, BDC Venture Capital and Alta Berkeley Venture Partners. In total, the company has raised $34 million in funding. The company is led by a highly experienced management team and board of directors. To view biographies visit the following links: http://teradici.com/company/management.html and http://teradici.com/company/directors.html.
Teradici Corporation is a fabless semiconductor company
developing innovative technology for next-generation computer form
factors. Through a combination of unique algorithms and high-performance
silicon processing, the company is focused on enabling a new approach
for how personal computers are deployed and managed. Teradici is
headquartered in Burnaby, British Columbia, Canada. More information
will be made available at www.teradici.com.
Phillip Bergman
Roher Public Relations
(914) 238-2200, ext 302
pbergman@roherpr.com
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